Hello, everyone! Here is Bingyang Guo’s academic page. Thanks for the template provided by AcadHomepage!
Biography
I received the doctoral degree in the Software College at the Northeastern University (Shenyang, China), advised by Prof. Ruiyun Yu. I received the bachelor’s degree in the School of Mechanical Engineering at the Shenyang Ligong University, and the master’s degree in the School of Mechanical Engineering and Automation at the Northeastern University, advised by Prof. Yunhui Yan and Prof. Kechen Song, within Machine Vision & Robotics Lab.
My academic interests revolve around AI4Industry, especially focus on Industrial Surface Defect Segmentation under Data-scarcity Scenarios, including Zero/Few-shot segmentation, Weakly-supervised segmentation, 2D-3D visual fusion, and Large Vision Model. If you are interested in any aspect of me, I am always open to discussions and collaborations. Feel free to reach out to me at - guobingyang0410@gmail.com
News
- 2026.08: Our paper addressed 3D-AD in industrial equipment components is accepted by IEEE TCSVT!
- 2026.06: Our paper addressed cross-modal detection in IC field is accepted by IECON 2026!
- 2026.05: Our paper addressed zero-shot classification in IC field is accepted by Pattern Recognition!
- 2026.04: Our paper addressed few-shot segmentation in IC field is accepted by IEEE Transactions on Industrial Informatics!
- 2026.03: I was invited to serve as a guest editor for a special issue of Electronics! We welcome contributions from experts and scholars!
- 2026.02: Our paper addressed super resolution in industrial detection is accepted by IEEE/ASME Transactions on Mechatronics!
- 2025.12: Our paper addressed 3D-AD is accepted by Pattern Recognition!
- 2025.11: Our paper addressed Integrated circuits package substrate 3D segmentation is accepted by AAAI 2026! The new dataset CPS3D-Seg proposed in the paper is the first 3D defect detection dataset of integrated circuit!
- 2025.09: Our achievement high precision visual inspection technology and application of ceramic package substrate won the gold award of the 11th International Invention Exhibition!
- 2025.08: Our dataset CPS2D-AD is selected into the first batch of high-quality dataset cases of the national data administration!
- 2025.07: Our paper addressed Integrated circuits package substrate few-shot classification is accepted by IECON 2025!
- 2025.06: Our paper addressed Integrated circuits package substrate anomaly detection is accepted by ICCV 2025! The new dataset CPS2D-AD proposed in the paper is currently the largest integrated circuit defect detection dataset in the world!
- 2025.03: Our paper addressed Few-shot metal surface segmentation is accepted by IEEE TIM!
- 2024.09: We acquire the funding from the key research and development projects of Liaoning Province (Research and Application of Key Technologies for Multi-modal Industrial Product Surface Defect Detection Large Model)!
- 2024.04: Our paper addressed Transferable recommendation is accepted by IEEE TKDE (CCF A)!
- 2024.03: Our paper addressed Weakly-supervised metal surface segmentation is accepted by IEEE TIM!
- 2023.12: Our large vision model for industrial surface defect detection Qing Que obtained Huawei Ascend Technology Certification!
- 2023.05: We acquire the funding from the Fundamental Research Funds for the Central Universities.
- 2023.01: Our paper addressed Real-time metal surface segmentation is accepted by IEEE TII!
- 2022.08: Our paper addressed Few-shot metal surface segmentation is accepted by IEEE TIM!
Educations
- 2021.09 - 2026.06, Northeastern University, Software College, Ph.D in Software Engineering
- 2018.09 - 2021.06, Northeastern University, School of Mechanical Engineering & Automation, M.S. in Mechanical Design & Theory
- 2014.09 - 2018.06, Shenyang Ligong University, School of Mechanical Engineering, B.S. in Mechanical Design, Manufacture & Automation
Publications
# co-first author * corresponding author
Journal Publications
IEC3D-AD: A 3D Dataset of Industrial Equipment Components for Unsupervised Point Cloud Anomaly Detection
IEEE Transactions on Circuits and Systems for Video Technology (TCSVT), 2026.
A Unified Multimodal Framework Towards Semantic and Spatial Understanding on Packaging Surface Defects
IECON (PR), 2026.
EDNet: Zero-shot Classification for Ceramic Package Substrates Surface Defect with Embedding Diffusion Network
Pattern Recognition (PR), 2026.
Hybrid-space Interaction Network for Effective Single-Image Super-Resolution in Defect Detection
IEEE/ASME Transactions on Mechatronics (T-Mech), 2026.
Dynamic Cross Characterization Network for Few-Shot IC Package Substrates Surface Defect Segmentation
IEEE Transactions on Industrial Informatics (TII), 2026.
A Lightweight 3D Anomaly Detection Method with Rotationally Invariant Features
Pattern Recognition (PR), 2025.
Background-weaken Generalization Network for Few-Shot Industrial Metal Defect Segmentation
IEEE Transactions on Instrumentation and Measurement (TIM), 2025.
Dynamic Reasoning Network for Image-level Supervised Segmentation on Metal Surface Defect
IEEE Transactions on Instrumentation and Measurement (TIM), 2024.
Is multi-level data enhancement helpful for knowledge graph? A new perspective on multimodal fusion
Knowledge-Based Systems (KBS), 2024.
Interaction Subgraph Sequential Topology-Aware Network for Transferable Recommendation
IEEE Transactions on Knowledge and Data Engineering (TKDE), 2024.
SPEED: Semantic prior and extremely efficient dilated convolution network for real-time metal surface defects detection
IEEE Transactions on Industrial Informatics (TII), 2023.
Selective prototype network for few-shot metal surface defect segmentation
IEEE Transactions on Instrumentation and Measurement (TIM), 2022.
NERNet: Noise estimation and removal network for image denoising
Journal of Visual Communication and Image Representation (JVCIR), 2020.
Conference Publications
Point Cloud Segmentation of Integrated Circuits Package Substrates Surface Defects Using Causal Inference: Dataset Construction and Methodology
The 40th Annual AAAI Conference on Artificial Intelligence (AAAI), 2026.
Fine-Grained Region Perception Network for Few-shot Defect Classification of IC Package Substrates: Benchmark Methodology and Dataset
The Annual Conference of the IEEE Industrial Electronics Society (IECON), 2025.
Anomaly Detection of Integrated Circuits Package Substrates Using the Large Vision Model SAIC: Dataset Construction, Methodology, and Application
International Conference on Computer Vision (ICCV), 2025.
The interaction graph auto-encoder network based on topology-aware for transferable recommendation
Proceedings of the 31st ACM International Conference on Information & Knowledge Management (CIKM), 2022.
Manuscripts under Review
3D Anomaly Detection: Approaches, Benchmark, Challenges, and Prospects for Intelligent Manufacturing
Journal of Intelligent Manufacturing (JIMS), under review.
Projects
Auto Optical Inspection (AOI) Equipment for Final Product of Ceramic Package Substrate
- Constructed an AOI equipment platform for ceramic package substrate final product inspection.
- Collected a comprehensive multi-view image dataset for ceramic package substrate surface inspection.
Auto Optical Inspection (AOI) Equipment for Printing Process of Ceramic Package Substrate
- Constructed an AOI equipment platform for the printing process.
- Collected a comprehensive high-resolution image dataset for ceramic package substrate surface inspection.
Double CCD Structured Light Measurement System
- Constructed a double CCD structured light measurement system for mechanical basic components.
- Collected a high-resolution point cloud dataset for 3D anomaly detection of mechanical basic components.
Multiple Line Laser Scanning Equipment
- Constructed multiple line laser scanning equipment for ceramic package substrate surfaces.
- Collected high-resolution point clouds for ceramic package substrate 3D inspection.
Engine Automatic Assembly System
- Constructed a multi-axis linkage digital installation rack vehicle.
- Constructed an automatic installation digital twin system for aircraft engines.
Academic Service
- Journal Editor, Electronics - Intelligent Sensing Empowered by Artificial Intelligence, Guest Editor.
- Journal Reviewer, IEEE TIP, IEEE TNNLS, IEEE TII, IEEE TIM, etc.
- Conference Reviewer, CVPR, ACM MM, NeurIPS, etc.
Honors and Awards
- Northeastern University President’s Medal (only 10 students selected each year)
- First Prize of the China Invention Association Invention and Entrepreneurship Award
- Gold Award at the 11th International Invention Exhibition