Bingyang Guo

Bingyang Guo

Northeastern University

Hello, everyone! Here is Bingyang Guo (Aries, 郭冰洋)’s academic page. Thanks for the template provided by AcadHomepage!

🧍‍♂️ Biography

I am pursuing my PhD degree in the Software College at the Northeastern University (Shenyang, China), advised by Prof. Ruiyun Yu. I received the bachelor’s degree in the School of Mechanical Engineering at the Shenyang Ligong University, and the master’s degree in the School of Mechanical Engineering and Automation at the Northeastern University, advised by Prof. Yunhui Yan and Prof. Kechen Song, within Machine Vision & Robotics Lab.

My academic interests revolve around AI4Industry, especially focus on Industrial Surface Defect Segmentation under Data-scarcity Scenarios, including Zero/Few-shot segmentation, Wealy-supervised segmentation, 2D-3D visual fusion, and Large Vision Model. If you are interested in any aspect of me, I am always open to discussions and collaborations. Feel free to reach out to me at - wxqmdr@gmail.com

🔥 News

  • 2025.12:  🎉🎉 Our paper addressed 3D-AD is accepted by Pattern Recognition!
  • 2025.11:  🎉🎉 Our paper addressed Integrated circuits package substrate 3D segmentation is accepted by AAAI 2026! The new dataset CPS3D-Seg proposed in the paper is the first 3D defect detection dataset of integrated circuit!
  • 2025.09:  🎉🎉 Our achievement high precision visual inspection technology and application of ceramic package substrate won the gold award of the 11th International Invention Exhibition!
  • 2025.08:  🎉🎉 Our dataset CPS2D-AD is selected into the first batch of high-quality dataset cases of the national data administration!
  • 2025.07:  🎉🎉 Our paper addressed Integrated circuits package substrate few-shot classification is accepted by IECON 2025!
  • 2025.06:  🎉🎉 Our paper addressed Integrated circuits package substrate anomaly detection is accepted by ICCV 2025! The new dataset CPS2D-AD proposed in the paper is currently the largest integrated circuit defect detection dataset in the world!
  • 2025.03:  🎉🎉 Our paper addressed Few-shot metal surface segmenation is accepted by IEEE TIM!
  • 2024.09:  🎉🎉 We acquire the funding from the key research and development projects of Liaoning Province (Research and Application of Key Technologies for Multi-modal Industrial Product Surface Defect Detection Large Model)!
  • 2024.04:  🎉🎉 Our paper addressed Transferable recommendation is accepted by IEEE TKDE (CCF A)!
  • 2024.03:  🎉🎉 Our paper addressed Weakly-supervised metal surface segmenation is accepted by IEEE TIM!
  • 2023.12:  🎉🎉 Our large vision model for industrial surface defect detection Qing Que obtained Huawei Ascend Technology Certification!
  • 2023.05:  🎉🎉 We acquire the funding from the Fundamental Research Funds for the Central Universities.
  • 2023.01:  🎉🎉 Our paper addressed Real-time metal surface segmenation is accepted by IEEE TII!
  • 2022.08:  🎉🎉 Our paper addressed Few-shot metal surface segmenation is accepted by IEEE TIM!

📖 Educations

  • 2021.09 - now, Northeastern University, Software College, Ph.D Candidate in Software Engineering
  • 2018.09 - 2021.07, Northeastern University, School of Mechanical Engineering & Automation, M.S. in Mechanical Design & Theory
  • 2014.09 - 2018.07, Shenyang Ligong University, School of Mechanical Engineering, B.S. in Mechanical Design, Manufacture & Automation

📝 Publications

# co-first author

* corresponding author

Journal Publications

  1. A Lightweight 3D Anomaly Detection Method with Rotationally Invariant Features [Paper]
    Hanzhe Liang, Jie Zhou, Can Gao*, Bingyang Guo, Jinbao Wang, and Linlin Shen
    Pattern Recognition(PR). 2025.
  2. Background-weaken Generalization Network for Few-Shot Industrial Metal Defect Segmentation [Paper]
    Ruiyun Yu, Haoyuan Li*, Bingyang Guo, Ziming Zhao
    IEEE Transactions on Instrumentation and Measurement(TIM). 2025.
  3. Dynamic Reasoning Network for Image-level Supervised Segmentation on Metal Surface Defect [Paper]
    Ruiyun Yu, Bingyang Guo*, Kang Yang
    IEEE Transactions on Instrumentation and Measurement (TIM). 2024.
  4. Is multi-level data enhancement helpful for knowledge graph? A new perspective on multimodal fusion [Paper]
    Kang Yang, Ruiyun Yu*, Bingyang Guo
    Knowledge-Based Systems(KBS). 2024.
  5. Interaction Subgraph Sequential Topology-Aware Network for Transferable Recommendation [Paper]
    Kang Yang, Ruiyun Yu*, Bingyang Guo, Jie Li
    IEEE Transactions on Knowledge and Data Engineering(TKDE). 2024.
  6. SPEED: Semantic prior and extremely efficient dilated convolution network for real-time metal surface defects detection [Paper]
    Bingyang Guo, Ruiyun Yu*, Kang Yang
    IEEE Transactions on Industrial Informatics(TII). 2023.
  7. Selective prototype network for few-shot metal surface defect segmentation [Paper]
    Ruiyun Yu, Bingyang Guo*, Kang Yang
    IEEE Transactions on Instrumentation and Measurement (TIM). 2022.
  8. NERNet: Noise estimation and removal network for image denoising [Paper]
    Bingyang Guo, Kechen Song*, Hongwen Dong, Yunhui Yan*, Zhibiao Tu, Liu Zhu
    Journal of Visual Communication and Image Representation (JVCIR). 2020.

Conference Publications

  1. Point Cloud Segmentation of Integrated Circuits Package Substrates Surface Defects Using Causal Inference: Dataset Construction and Methodology [Paper]
    Bingyang Guo ，Hongjie Li, Ruiyun Yu*
    The 40th Annual AAAI Conference on Artificial Intelligence(AAAI).
  2. Fine-Grained Region Perception Network for Few-shot Defect Classification of Ic Package Substrates: Benchmark lethodology and Dataset [Paper]
    Haoyuan Li, Ruiyun Yu*, Bingyang Guo
    The Annual Conference of the IEEE Industrial Electrics Society(IECON).
  3. Anomaly Detection of Integrated Circuits Package Substrates Using the Large Vision Model SAIC: Dataset Construction, Methodology, and Application [Paper]
    Ruiyun Yu, Bingyang Guo*, Haoyuan Li
    International Conference on Computer Vision(ICCV).
  4. The interaction graph auto-encoder network based on topology-aware for transferable recommendation [Paper]
    Ruiyun Yu, Kang Yang*, Bingyang Guo
    Proceedings of the 31st ACM International Conference on Information & Knowledge Management(CIKM 2022). 2022.

Manuscripts under Review

  1. EDNet: Zero-shot Classification for Ceramic Package Substrates Surface Defect with Embedding Diffusion Network
    Bingyang Guo, Yuting Wang, Ruiyun Yu*
    Pattern Recognition(PR). (Under Review)
  2. IEC3D-AD: A 3D Dataset of Industrial Equipment Components for Unsupervised Point Cloud Anomaly Detection
    Bingyang Guo, Hongjie Li, Ruiyun Yu*
    IEEE Transactions on Circuits and Systems for Video Technology(TCSVT). (Under Review)
  3. When Large Models Meet Integrated Circuit: A Unified Multimodal Framework for Semantic and Spatial Understanding on Ceramic Package Substrate Surface Defects
    Bingyang Guo, Ruiyun Yu*, Haoyuan Li, Bang An
    Pattern Recognition(PR). (Under Review)
  4. Hybrid-space Interaction Network for Effective Single-Image Super-Resolution in Defect Detection
    Haoyuan Li, Ruiyun Yu*, Bingyang Guo, Bang An, Shi Zhen
    IEEE/ASME Transactions on Mechatronics(T-Mech). (Reject & Resubmit)
  5. Dynamic Cross Characterization Network for Few-Shot IC Package Substrates Surface Defect Segmentation
    Ruiyun Yu, Haoyuan Li*, Bingyang Guo
    IEEE Transactions on Industrial Informatics(TII). (Reject & Resubmit)

💻 Projects

  1. Auto Optical Inspection (AOI) Equipment for Final Product of Ceramic Package Substrate (2025.09 - Now)
    AOI Equipment
    1. constructed a AOI equipment for ceramic package substrate final product.
    2. collected a comprehensive dataset of multi-view images for ceramic package substrate surface inspection.
  2. Auto Optical Inspection (AOI) Equipment for Printing Process of Ceramic Package Substrate (2024.07 - Now)
    AOI Equipment
    1. constructed a AOI equipment for printing process.
    2. collected a comprehensive dataset of high-resolution images for ceramic package substrate surface inspection.
  3. Double CCD Structured Light Measurement System (2024.02 - 2024.07)
    Measurement System
    1. constructed a double CCD structured light Measurement system for mechanical basic components.
    2. collected a comprehensive dataset of high-resolution point clouds for mechanical basic components 3D anomaly detection.
  4. Multiple Line Laser Scanning Equipment (2023.11 - 2024.06)
    Scanning Equipment
    1. constructed a multiple line laser scanning equipment for ceramic package substrate surface.
    2. collected a comprehensive dataset of high-resolution point clouds for ceramic package substrate 3D inspection.
  5. Engine Automatic Assembly System (2021.12 - 2023.09)
    Assembly System
    1. constructed a multi-axis linkage digital installation rack vehicle.
    2. constructed an automatic installation digital twin system for aircraft engines.

🎓 Academic Service

  • Journal Reviewer, IEEE TIP, IEEE TNNLS, IEEE TII, IEEE TIM, etc.
  • Conference Reviewer, CVPR, ACM MM, NeurIPS, etc.

🎖 Honors and Awards

  • First-class Scholarship for PhD, NEU, 2022.09, 2023.09, 2024.09
  • Excellent Paper of Liaoning Computer Federation, 2022.12
  • Outstanding Graduate of Northeastern University, 2021.07
  • Yantai Guoye Scholarship, NEU, 2020.09
  • First-class Scholarship, NEU, 2018.09, 2019.09, 2020.09
  • Outstanding graduates from Liaoning Province, 2018.07
  • First-class Scholarship, SYLU, 2016.09, 2017.09
  • Second-class Scholarship, SYLU,2015.09

🎈 Generalist

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